THE 16th IEEE CONFERENCE ONINDUSTRIAL ELECTRONICS AND APPLICATIONS

 

TT21

Power Electronics (7)

 

1.           1036: Analysis of the Influence of Voids in Solder Layer on IGBT Failure based on ANSYS

              Guangzhi Yang, Dong Liu, Zhenwei Li, Wei Wang, Tao Wang, Xidan Heng

              email: 502173657@qq.com

 

2.           1040: Reliability Modeling and Simulation Analysis of IGBT Devices based on Saber Software

              Wei Wang, Qilong Jiang, Zhenwei Li, Guangzhi Yang, Tao Wang, Dong Liu           

              email: 912496884@qq.com

 

3.           1050:  A Research on Inductance Forcedly Absorbing Current to Reduce Stray Current in Metro         

              Ying Wang, Tianqi Wen, Fan Yu, Yuanfa Mao, Qian Wu, Shijie Liu, Fanglin Liu, Hongyun He, Ronggui Wang

              Email: wentianqi_lanzhou@163.com     

 

4.           1056: Degradation Assessment of Photovoltaic Module Based on Probability Distribution Analysis of Model Parameters

              Jingwei Zhang, Li Feng, Kun Ding, Frank U. Hamelmann, Xihui Chen, Xiang Chen, Ling Chen

              email: jwzhang@hhu.edu.cn     

 

5.           1063: Adaptive Terminal Sliding Mode Control for Magnetic Levitation System With Observe 

              Wei FENG, Jianhua HAO, Sen WANG, Xianchao MA, Xicong SUN, Yongzhi JING

              email: f13114403750@163.com

 

6.          1067: Optimization of Magnetic Coupling Resonance Coils

              Sen Wang, Xicong Sun, Wei Feng, Xianchao Ma, Yongzhi Jing, Songqi Li

              email: 1571612293@qq.com

 

7.          1074: Capacitive coupling wireless energy transmission constant voltage system based on composite network resonance

              Guoheng Jing, Yifei Li, Zhifei Zhang, Cheng Qian, Qianwen Gong, Yongzhi Jing

              email: 1032014946@qq.com