THE 16th IEEE CONFERENCE ONINDUSTRIAL ELECTRONICS AND APPLICATIONS
TT21
Power
Electronics (7)
1.
1036: Analysis of the Influence of Voids in Solder Layer on IGBT Failure based
on ANSYS
Guangzhi Yang, Dong Liu, Zhenwei Li, Wei Wang, Tao Wang, Xidan Heng
email: 502173657@qq.com
2. 1040: Reliability Modeling and Simulation Analysis of IGBT Devices based on Saber Software
Wei Wang, Qilong Jiang, Zhenwei Li, Guangzhi Yang, Tao Wang, Dong Liu
email: 912496884@qq.com
3. 1050: A Research on Inductance Forcedly Absorbing Current to Reduce Stray Current in Metro
Ying Wang, Tianqi Wen, Fan Yu, Yuanfa Mao, Qian Wu, Shijie Liu, Fanglin Liu, Hongyun He, Ronggui Wang
Email: wentianqi_lanzhou@163.com
4. 1056: Degradation Assessment of Photovoltaic Module Based on Probability Distribution Analysis of Model Parameters
Jingwei Zhang, Li Feng, Kun Ding, Frank U. Hamelmann, Xihui Chen, Xiang Chen, Ling Chen
email: jwzhang@hhu.edu.cn
5. 1063: Adaptive Terminal Sliding Mode Control for Magnetic Levitation System With Observe
Wei FENG, Jianhua HAO, Sen WANG, Xianchao MA, Xicong SUN, Yongzhi JING
email: f13114403750@163.com
6. 1067: Optimization of Magnetic Coupling Resonance Coils
Sen Wang, Xicong Sun, Wei Feng, Xianchao Ma, Yongzhi Jing, Songqi Li
email: 1571612293@qq.com
7. 1074: Capacitive coupling wireless energy transmission constant voltage system based on composite network resonance
Guoheng Jing, Yifei Li, Zhifei Zhang, Cheng Qian, Qianwen Gong, Yongzhi Jing
email: 1032014946@qq.com